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Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.
There are not too many high-frequency packaging books on market. This is a valuable one. The books introduces the packaging materials and manufacturing methods. Then the book discusses lots of types of transmission lines and transition structures between different kinds of transmission lines. The book is an introduction of different topics. Detailed analysis has to be found in the references at each of the chapters. In general, this is a good book if you are doing high-frequency circuits packaging.